Quick Take
Quick Take: Treat PowerEdge R670 as a new platform. Pick E-core or P-core first, then DIMM speed, then the drive chassis. Copying an R660 BOM orders parts the 1U Xeon 6 server cannot use. For China enterprise RFQs, freeze the equal brief for 双规比选 before asking TAOHAN for 13% VAT special fapiao pricing.
What R670 Is (and Is Not)
Definition: Dell PowerEdge R670 is a 1U two-socket rack server for two Intel Xeon 6 processors — either E-core (up to 144 cores per CPU) or P-core (up to 86 cores per CPU). It is not an R660 with a refreshed BIOS. CPU, DIMM generation, and drive carriers are not interchangeable with R660.
Think of pasting an R660 BOM onto R670 like putting diesel in a petrol car: the rack unit looks similar, the fuel (CPU/DIMM/cage) is not. CXL 2.0 is supported only on Xeon 6 P-core per Dell’s technical guide. Optional direct liquid cooling (DLC) applies only to required CPU SKUs.
Fit: new 1U virtualization or dense NVMe builds.
Unfit: a GPU box that needs more than 3× 75 W single-wide accelerators.
Key Specs Buyers Must Freeze
Quick Answer: Two Xeon 6 CPUs, 32 DDR5 RDIMM slots up to 8 TB / 6400 MT/s, E3.S or 2.5-inch storage options, up to 3× PCIe Gen5 x16, optional DLC on marked CPUs, and firmware minima for certain P-core SKUs.
| Item | Published figure | Buyer note |
|---|---|---|
| Form / sockets | 1U / 2× Xeon 6 | E-core or P-core — write the letter |
| Sample E-core | 6710E 64C 205 W DDR5-5600; 6756E 128C 225 W DDR5-6400 | Confirm exact CPU PID on quote |
| Sample P-core | 6787P 86C 350 W DDR5-6400; 6767P class | CXL 2.0 on P-core only |
| Memory | 32 DDR5 RDIMM / up to 8 TB / up to 6400 MT/s | 16 DIMMs per CPU |
| Storage options | up to 8/16/20 E3.S; up to 8×2.5 SATA/NVMe/Universal; up to 10×2.5 SATA; up to 2 rear E3.S | Front-I/O vs rear-I/O differ |
| PCIe / OCP / GPU | up to 3×16 Gen5; 2× OCP 3.0; up to 3×75 W SW GPU | DPU example: BlueField-3 B3220 |
| PSU examples | 1400 W -48 VDC; 1800 W HLAC Ti; 1500 W 277 Vac/HVDC Ti | Do not invent a 1100 W SKU |
| Firmware example | 6787P/6767P need iDRAC 1.20.25.00, BIOS 1.2.6, FPGA 107.114.104 | Old iDRAC will not post new P-core |
- NIC speeds Dell names: 1/10/25/100/400 GbE.
- No public net price. Soft corridors = industry estimate / pending confirmation.
- On China pages, treat R670 as an imported dual-socket path — not a 信创 substitute label.
R670 vs R660 — Why One BOM Fails
Quick Answer: R660 is the previous 1U dual-socket Intel generation. R670 is Xeon 6. Shared option sets silently order wrong CPUs, DIMMs, and drive cages.
| Dimension | R670 | R660 (contrast) |
|---|---|---|
| CPU generation | Intel Xeon 6 (E or P) | 4th/5th Gen Xeon Scalable class |
| DIMM | 32× DDR5 up to 6400 | Not drop-in to R670 |
| Drive carriers | E3.S / 2.5 options as listed | Not interchangeable cages |
| CXL | P-core only | Do not assume from R660 habit |
| Quote rule | New platform worksheet | Separate line if still purchased |
BOM Checklist Before PO
- CPU letter: E-core or P-core + exact PID on the dated quote.
- DIMM count, capacity, and MT/s matched to that CPU.
- Drive chassis: E3.S vs 2.5-inch; front-I/O vs rear-I/O.
- PCIe / OCP / GPU / DPU lines within published envelopes.
- PSU from the published examples — no invented wattage SKUs.
- DLC only if Dell marks the CPU as requiring it.
- iDRAC/BIOS minima when reusing a chassis with new P-core CPUs.
- If R660 remains: second line, separate option set.
HowTo: Build an R670 RFQ from a Workload Instead of an R660 Spreadsheet
- Step 1 — Pick E-core or P-core. Choose Xeon 6 E-core or P-core first — DIMM speed and CXL follow the letter.
- Step 2 — Lock DIMM map. 32 DDR5 slots, 16 per CPU, up to 8 TB; confirm MT/s for the CPU SKU.
- Step 3 — Pick drive chassis. E3.S vs 2.5-inch / front-I/O vs rear-I/O are different cages — do not paste R660 carriers.
- Step 4 — Check DLC and firmware. If Dell marks DLC required, quote it; confirm iDRAC/BIOS minima for P-core examples.
- Step 5 — Separate mixed fleets. R660 leftovers stay on their own line — never one shared option matrix.
- Step 6 — Equal brief. Freeze the equal BOM for 双规比选 before channel confirmation.
Contact TAOHAN for China enterprise R670 BOM review with 13% VAT special fapiao support — domestic delivery, not Hong Kong local stock as the main CTA.
Real-World Deployment Scenarios
1) VM dense 1U refresh
Buyer pastes R660 CPU and DIMM rows onto R670. Quote fails configurator. Fix: pick E-core vs P-core, then DIMM speed.
2) E3.S vs 2.5-inch surprise
Storage team expects 2.5-inch carriers; chassis is E3.S. Drives do not seat. Fix: freeze cage type on the equal brief.
3) Mixed fleet PO
One spreadsheet mixes R670 new build and leftover R660 spares as one option matrix. Receiving chaos. Fix: two lines, two option sets.
FAQ
Is R670 a faster R660?
Do I need liquid cooling?
How much memory?
Can one quote mix R670 and R660?
References
- PowerEdge R670 spec sheet (PDF)
- PowerEdge R670 technical guide (PDF)
- R670 processor specifications (manual)
- Dell PowerEdge R670 product page
Key Takeaway
Key Takeaway: R670 is a new Xeon 6 platform. Do not reuse an R660 BOM. Lock E/P-core, DIMM speed, and drive chassis before price. TAOHAN supports China enterprise equal BOMs and 13% VAT special fapiao after the brief is frozen.
Related reading
Need an R670 vs R660 BOM review?
Send the workload and any leftover R660 lines to TAOHAN. We help freeze equal briefs for 双规比选 and support 13% VAT special fapiao — domestic delivery, not Hong Kong local stock as the main CTA.
Contact TAOHAN · R670 BOM reviewEmail: info@021taohan.com · Tel: 17708821321